Atomic layer deposition (ALD) is widely used as a tool for the formation of near-atomically flat and uniform thin films in the semiconductor and display industries because of its excellent uniformity. Nowadays, ALD is being extensively used in diverse fields, such as energy and biology. By controlling the reactivity of the surface, either homogeneous or inhomogeneous coating on the shell of nanostructured powder can be accomplished by the ALD process. However, the ALD process on the powder largely depends on the displacement of powder in the reactor. Therefore, the technology for the fluidization of the powder is very important to redistribute its position during the ALD process. Herein, an overview of the three types of ALD reactors to agitate or fluidize the powder to improve the conformality of coating is presented. The principle of fluidization its advantages, examples, and limitations are addressed.

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• High-performance of ZnO/TiO2 heterostructured thin-film photocatalyst fabricated via atomic layer deposition
  Ji Young Park, Jeong Hwan Han, Byung Joon Choi
  Journal of Vacuum Science & Technology A.2024;[Epub]     CrossRef
• Atomic layer deposition of ZnO layers on Bi2Te3 powders: Comparison of gas fluidization and rotary reactors
  Myeong Jun Jung, Myeongjun Ji, Jeong Hwan Han, Young-In Lee, Sung-Tag Oh, Min Hwan Lee, Byung Joon Choi
  Ceramics International.2022; 48(24): 36773.     CrossRef